2023年1月2日星期一
杜邦宣布2023年正式推出新品牌 Micromax™
2021年11月24日星期三
BondlineClass VI Medical六类级医疗级导电银胶
我司有专业的超低温冷链进口渠道，全程冷链空运，保证货品性能安全可靠，如有需要请致电1392125860
Bondline Electronic Adhesives is a U.S. based manufacturer of premixed and film adhesives.
Founded in 1989, company headquarters and main laboratory are located in the heart of Silicon Valley in Sunnyvale, CA. Bondline is a leading manufacturer of adhesives, supplying high-quality performance epoxy adhesives to companies in semiconductor, medical device, microelectronic, and aerospace industries. In addition to our standard line of epoxy adhesives, we custom formulate along with repackaging commercially available materials.
Bondline Electronic Adhesives is committed to adhesive products' highest quality through dedication to product reliability, conformance to specifications, and timely delivery. We are committed to distinguishing ourselves as a reliable and responsive adhesive company serving customers domestically and internationally.
Bondline 2080
Silver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure.
Bondline 2106
Flexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C.
Flexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure.
Bondline 2120
Silver filled, low viscosity, room temperature cure epoxy adhesive. Electrical grounding, recording heads, quick cure. Low volume resistivity, room temperature cure options.
Bondline 2121
Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.
Bondline 2156
A resilient tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion ,low volume resistivity and thermal conductivity.
Bondline 2158
A tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure.
Bondline 2258
Flexible, silver filled epoxy for Bonding chips to substrate with mismatch in CTE. Great for die sizes greater than .400 sq. in to flex-circuit miniature LCD display. Semiconductor Grade.
Bondline 2485
Silver filled, snap cure adhesive, microelectronic chip bonding, automatic dispensing. Quick cure. 10 day work life, low volume resistivity, 2.57 w/mK - Thermal Conductivity.
Bondline 2490
Electrically conductive epoxy adhesive for chip bonding. Microelectronic applications, automatic dispensing, screen printing or hand dispense, high Tg 143° C.
Bondline 2900
Silver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.
Bondline 2900LV
Low viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.
Bondline 2920
New Ultra Clean Conductive Epoxy! The latest clean epoxy from Bondline. This adhesive has low water extractable ionic contaminates, and a 6 day work life.
Bondline 2948
Silver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed.
Bondline 2949
Silver filled semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive and is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.
2020年7月5日星期日
Stretchable Electronics Inks
gzyinbao has combined Printed Electronics and textile printing to offer new conductive and protective inks for printing stretchable electronics on fabricInks
gzyinbao provides an assorted range of materials for “Stretchable Electronics” applications, such as:
Silver Based (micrometric flakes) Conductive Inks
Protective/Encapsulating Inks
Adhesive inks for Transfer Printing
All the Inks are:
Water-based
Screen printable
Highly stretchable (tested up to 100% of elongation)
Protective/ encapsulating inks are used in synergy with conductive inks. Their functions are:
Structural support/mechanical stress absorption
Barrier to water (for washing resistance)
Electrical insulation
Printing Technology
elastic (TPU) membranes are used as printing substrate to be further laminated on the final product surface:
In case of textile applications (smart-garments, wearable technology type of applications) the transfer printing technology is used to transfer, by heat and pressure, the ink layer set from a sacrificial substrate to the final fabric
In case of other applications the printed stack of inks can be peeled-off from the sacrificial substrate for further handling
The transfer printing process is explained in the picture below.
Figure 1. – Process in the case of final application on fabric
Ink layers and a thermoplastic glue are screen printed on a sacrificial substrate
The ink layer set is transferred, using a heat press, by activating the thermoplastic glue (current parameters are: 180°C/4 bar/15 sec)
The sacrificial substrate is peeled-off
Final curing is performed (5 min at 150°C for best performances)
The adopted technology has a few advantages:
Reliable printing on a smooth and stable (sacrificial) substrate
Full additive and simpler process. No membrane laser cutting-out is required as the printing substrate is totally removed after the transfer of the ink stack onto the final substrate
Better “look and feel” and comfort. No permanent intermediate substrate is left on the fabric.
Electrical performances under strain
There is no standard to evaluate stretchable conductive Inks. We test our inks with single elongations, up to 100%, and repeated cycles (typically 1000) of 0-20% elongations.
Initial sheet resistivity is <30 mOhm/square@25micron (after curing of the ink at 150°C for 5min). The below graphs show the typical resistance behavior under strain.
Figure 2. – Single stretch
The above performances relate to a straight line conductive trace 150mm long/4mm wide
According to our experience many factors affect performances under strain:
Ink silver flakes characteristics, concentration and mix
Protective inks. Protective inks more resistant to washing exhibit a lower elasticity. This affects the overall electrical performance, especially under repeated strains
Final fabric, in particular the weave more than the raw material
Trace shape. Straight lines and corners are not the best performer
gzyinbao has developed base conductive inks and a few protective inks which can be customized for the specific application.
Please contact us (Stretchable Electronics Inks
gzyinbao has combined Printed Electronics and textile printing to offer new conductive and protective inks for printing stretchable electronics on fabricInks
gzyinbao provides an assorted range of materials for “Stretchable Electronics” applications, such as:
Silver Based (micrometric flakes) Conductive Inks
Protective/Encapsulating Inks
Adhesive inks for Transfer Printing
All the Inks are:
Water-based
Screen printable
Highly stretchable (tested up to 100% of elongation)
Protective/ encapsulating inks are used in synergy with conductive inks. Their functions are:
Structural support/mechanical stress absorption
Barrier to water (for washing resistance)
Electrical insulation
Printing Technology
elastic (TPU) membranes are used as printing substrate to be further laminated on the final product surface:
In case of textile applications (smart-garments, wearable technology type of applications) the transfer printing technology is used to transfer, by heat and pressure, the ink layer set from a sacrificial substrate to the final fabric
In case of other applications the printed stack of inks can be peeled-off from the sacrificial substrate for further handling
The transfer printing process is explained in the picture below.
Figure 1. – Process in the case of final application on fabric
Ink layers and a thermoplastic glue are screen printed on a sacrificial substrate
The ink layer set is transferred, using a heat press, by activating the thermoplastic glue (current parameters are: 180°C/4 bar/15 sec)
The sacrificial substrate is peeled-off
Final curing is performed (5 min at 150°C for best performances)
The adopted technology has a few advantages:
Reliable printing on a smooth and stable (sacrificial) substrate
Full additive and simpler process. No membrane laser cutting-out is required as the printing substrate is totally removed after the transfer of the ink stack onto the final substrate
Better “look and feel” and comfort. No permanent intermediate substrate is left on the fabric.
Electrical performances under strain
There is no standard to evaluate stretchable conductive Inks. We test our inks with single elongations, up to 100%, and repeated cycles (typically 1000) of 0-20% elongations.
Initial sheet resistivity is <30 mOhm/square@25micron (after curing of the ink at 150°C for 5min). The below graphs show the typical resistance behavior under strain.
Figure 2. – Single stretch
The above performances relate to a straight line conductive trace 150mm long/4mm wide
According to our experience many factors affect performances under strain:
Ink silver flakes characteristics, concentration and mix
Protective inks. Protective inks more resistant to washing exhibit a lower elasticity. This affects the overall electrical performance, especially under repeated strains
Final fabric, in particular the weave more than the raw material
Trace shape. Straight lines and corners are not the best performer
gzyinbao has developed base conductive inks and a few protective inks which can be customized for the specific application.
Please contact us (info@eptatech.com) to evaluate ink performances against your requirements
The offering
Stretchable electronics, offerta
gzyinbao can provide either the inks or the printed layer set ready to be transferred to the final fabric. The second option is recommended for initial tests or quick feasibility studies.
gzyinbao can provide direct assistance to Clients in the fine tuning of the printing processes, in the assessment of performances and in the evaluation of possible ink customizations.
E-mail: laiqiangping2010@163.com laiqiangping2015@gmail.com) to evaluate ink performances against your requirements
The offering
Stretchable electronics, offerta
gzyinbao can provide either the inks or the printed layer set ready to be transferred to the final fabric. The second option is recommended for initial tests or quick feasibility studies.
gzyinbao can provide direct assistance to Clients in the fine tuning of the printing processes, in the assessment of performances and in the evaluation of possible ink customizations.
E-mail: laiqiangping2010@163.com laiqiangping2015@gmail.com
2019年7月8日星期一
Electrochemical sensing based on printable temporary transfer tattoos
基于可印刷的电化学传感
临时转移纹身
Electrochemical sensing based on printable
temporary transfer tattoos
on the insulator design to define the working and counter electrode geometry. Finally, an Ag/AgCl-based
ink was employed to define the connection points as well as the reference electrode. After each printing
process, the patterned substrate was cured in a temperature-controlled convection oven (SalvisLab
Thermocenter, Renggli AG, Industrie-Ost, Switzerland) at 60 °C for 40 min and finally cut into individual
sensor tattoos for single use. In order to conduct electrochemical experiments, a tattoo pattern containing
a circular working electrode was designed and possessed a 3 mm radius. In order to increase the tensile
strength of the printed electrodes, 100 mg of chopped CFs were dispersed in 30 mL of ink and
homogenized thoroughly. It should be noted that the loading level cannot be adjusted arbitrarily high.
Exceeding the 0.04 % level compromised the viscosity of the ink and the ability to generate well-defined
printing patterns. Therefore, the 0.04 % CF reinforcement level was employed in all the studies.
Fig. S1: Transfer of the T3 sensor onto the epidermis: (a) The protective sheet is peeled from the
patterned T3 paper. (b) The paper is flipped and applied to the skin and subsequently dabbed with water
(c). Finally, the paper is gently removed (d), exposing the sensor contingent.
Fig. S2: Photographic evaluation of the CF-reinforced T3 sensor on human skin during (a) pinching and
(b) stretching.
Inks Sensors
Inks Medical
Ag/AgCl inks, are used extensively in
Medical sensors
Typical uses
Tens/EKG pads
Glucose sensors
Blood thinner sensors
These sensor inks record the current or
“potential” generated by the reactions of
different substances
From this the concentration of the
targeted substance can be calculated
Inks Medical (Iontophoresis)
With printed Ag/AgCl electrode, a small current is applied to activate human’s skin and ionize drug molecules, enhancing the delivery of drug or nutrition.
Increasing current can increase delivery rate
Inks Sensors
PTC ink (Positive temperature coefficient)
As these inks get hotter they also get higher in resistance. This allows them to regulate the current supplied to them.
FSR inks (Force senseresistor)
As pressure is applied these ink become more conductive.
In-Mold Electronics – Innovation for the Future
Apply all the benefits for IMD and now amplify it with IME conductive inks. Next generation printed electronics or printed circuitry are now possible. Fully functioning capacitive touch switches and electronics are now a reality with full 3-D design capability. Flat membrane switches meet IMD parts and smart packaging!
Innovative conductive inks are opening doors to new IME applications, sleeker and more durable designs, and simplified production processes.
为注塑模具电子（IME）提供定制解决方案
我们的专家不断扩展他们对新兴印刷电子技术的知识，并可以帮助您在现场调整您的模内电子（IME）图纸或原型进行批量生产。
IME提供一系列功能和优点，例如：
薄膜开关技术的低成本替代方案，因为它需要更少的原材料，而且没有组装。
独特，灵活的设计
极其可靠的电容式开关，因为没有活动部件
封装电路，传感器和其他组件。
消除电线允许薄的控制面板
无需笨重的技术盒。
减少浪费，使制造过程更加环保。
符合RoHS标准，不需要使用铅
暴露失败显着减少
适用于低电流应用
更少的零件和制造步骤
结合模内装饰（IMD）流程
IN-MOLD ELECTRONICS (IME)
- Lower cost alternative to Membrane Switch technology as it requires fewer raw materials, and no assembly.
- Unique, flexible design
- Extremely reliable Capacitive Switch as there are no moving parts
- Encapsulated circuit, sensors and other components.
- The elimination of wires allows for a thin, control panel
- Eliminates need for bulky tech boxes.
以上资材如有需要请来电咨询：13922125860- Produces less waste, making the manufacturing process more environmentally friendly.
- RoHS Compliant and does not require use of lead
- Significant reduction in exposure failures
- Good for low current applications
- Fewer parts and manufacturing steps
- Combined with the In-Mold Decorating (IMD) process
