Permanent Magnet Assembly
PRODUCT
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DESCRIPTION
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VISCOSITY
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LAP SHEAR (AL/AL)
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CURE SCHEDULE
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OPERATING TEMP
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400-76-1
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High strength low stress one component epoxy
|
100,000 cps
|
5,900 psi
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30 min at 150°C
|
-40 to 180°C
|
AC 109/SVF
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Two component surface activated acrylic
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12,000 cps
|
2,500 psi
|
1 min at 25°C
|
-54 to 150°C
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502-09
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High temperature resistant one component epoxy
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Paste
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3,100 psi
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30 min at 160°C
|
-40 to 220°C
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502-61
|
Toughened and flexible 54 Shore D epoxy
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Paste
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4,930 psi
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12 min at 150°C
|
-65 to 160°C
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702-80-1
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Non-metallic filled one component epoxy
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Paste
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4,000 psi
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20 min at 150°C
|
-40 to 200°C
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702-98
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Induction curable one component epoxy
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Paste
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3,200 psi
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2 min at 150°C
|
-40 to 200°C
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704-39
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Fast curing version version of 702-98
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Paste
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3,200 psi
|
2 min at 150°C
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-40 to 200°C
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704-08
|
Medium viscosity epoxy for gel banding
|
140,000 cps
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2,500 psi
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4 min at 150°C
|
-40 to 180°C
|
Membrane Switch
Product Designation
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Description
|
Typical Application/Benefit
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Application Method
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Electrical Resistance
Ohms/Sq/Mil | |
Silver Circuit Traces | |||||
CI-1001
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Silver-vinyl ink, highly conductive, flexible
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Circuit traces / Low Ω, low cost
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Screen Print
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< 0.015
| |
CI-1028
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Silver-polyester ink, high solids, wear resistant, fast dry
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Circuit traces / fine line printable, long switch actuation life
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Screen Print
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< 0.020
| |
CI-1036
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Silver-urethane ink, highly conductive, highly flexible
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Circuit traces / lowest Ω, highly creasable
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Screen Print
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< 0.010
| |
Carbon Resistors, Contact Pads | |||||
CI-2001
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Carbon-vinyl ink, general purpose
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Top coat for silver contacts, can blend with CI-1001 to target resistance
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Screen Print
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< 20
| |
CI-2002 Series
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Carbon inks, stable resistance
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Varied resistance blends for target resistance matching
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Screen Print
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20 – 100,000
| |
CI-2042
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Carbon ink, low ohm
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Low cost x-over, low ohm resistor
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Screen Print
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< 10
| |
CI-5001
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Nickel ink, highly wear resistant for ZIF connectors, low ohm
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ZIF tail contacts and jumpers, print in one pass
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Screen Print
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< 5
| |
Dielectric Insulators | |||||
DI-7502
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Dielectric, UV cure
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Silver trace and cross-over junction insulation, highly flexible
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Screen Print
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>1,000 Mega ohms
| |
DI-7521
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Dielectric, UV Cure
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Silver trace and cross-over junction insulation, moisture resistant
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Screen Print
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>1,000 Mega ohms
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DI-7009
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Heat cure insulator
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Silver trace insulation, highly flexible
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Screen Print
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>100 Mega ohms
| |
Miscellaneous | |||||
DB-1501
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Silver epoxy, single component
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SMD attachments, high shear strength, long stencil life
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Stencil Print
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0.0004 ohm-cm
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DB-1561
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Silver epoxy, two component
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SMD attachment, low temp cure
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Needle Dispense
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0.003 ohm-cm
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DI-7801
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UV pressure sensitive adhesive
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Selectively print PSA, eliminate die-cut tapes
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Screen Print
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>1,000 Mega ohms
| |
DI-7511
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UV spacer
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Thick printing for spacer formation, good insulation for silver traces
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Screen Print
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>1,000 Mega ohms
| |
CI-1035
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Silver-polyester, adhesion and stress compatible with ITO coated film.
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Capacitive or transparent touch switch, low temp cure
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Screen Print
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< 0.025
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